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infrared picosecond laser cutting machine

this picosecond laser cutting machine is mainly used in cutting,opening the window and uncovery for CVL/FPC/RF and thin multilayer board,as well as cutting a variety of substrates, such as ceramic,silicon,glass etc. fast speed,high precision without burn.

With CCD Positioning&Design of double station platform

Suitable for the cutting and forming of covering film (CVL), flexible board (FPC), soft and hard binding board (RF) and thin glass,thin multilayer board, as well as the uncovering of window box; It can be used for cutting various substrates, such as ceramics, silicon wafers, etc.


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Headquarters

Beyond Laser Corp

Shuitian 1st Road No.13,Tongle Community,Longgang District,Shenzhen,China 

Zip code: 518116

Tel:+86 755 89765109

Fax:86-75589765677

sales@chaoyuelaser.com

Mob:+86 18926522726





  



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