PCBA FPC board laser cutting machine Polymer Film Cutting Diamond Lens Cutting Silicon Wafer Cutter Ceramic Cutting Thin glass processing Sapphire Cutting Other common product cutting
PCBA FPC board online-offline marking machine 3D rotary automatic laser marking
this picosecond laser cutting machine is mainly used in cutting,opening the window and uncovery for CVL/FPC/RF and thin multilayer board,as well as cutting a variety of substrates, such as ceramic,silicon,glass etc. fast speed,high precision without burn.
With CCD Positioning&Design of double station platform
Suitable for the cutting and forming of covering film (CVL), flexible board (FPC), soft and hard binding board (RF) and thin glass,thin multilayer board, as well as the uncovering of window box; It can be used for cutting various substrates, such as ceramics, silicon wafers, etc.
Beyond Laser became the “Council Members of Guangdong Laser Industry Association”
2021-05-21 07:562021 New Year Celebration of Beyond Laser
2021-01-22 23:39Beyond Laser won the laser technology innovation award OFweek 2019
2019-10-14 08:34Beyond Laser machines for PCB/FPC achieved great success on Exhibition
2019-12-06 17:24Take a look back at New Year 2020 Celebration of Beyond Laser
2020-03-09 18:41New Industrial Park of Beyond Laser Factory
2019-10-26 19:54Seeking more foreign cooperator partner
2019-04-28 14:04Beyond Laser achieved success on Shenzhen International Circuit Sourcing Show on Aug 28-30th
2019-09-01 17:49Beyond Laser moved to a larger new industrial park because of business growing
2019-10-05 09:52Laser Machine Applications
2018-08-27 13:43Headquarters
Beyond Laser Corp
Shuitian 1st Road No.13,Tongle Community,Longgang District,Shenzhen,China
Zip code: 518116
Tel:+86 755 89765109
Fax:86-75589765677
sales@chaoyuelaser.com
Mob:+86 18926522726
Copyright© 2018 Shenzhen Beyond Laser Technology Co., Ltd. All rights